on front Stylus profilometer step measurement |
|
| Contact force Force applied at contact point |
5 mN |
|---|
| Depth |
0 .. 1000 µm |
|---|
| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
step |
|---|
| Max field size |
20 mm |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
Veeco Dektak 200SL |
| Equipment characteristics: |
| Batch sizes |
10 .. 150 mm: 1 |
|---|
| MOS clean |
no |
|---|
| Piece dimension Range of wafer piece dimensions the equipment can accept |
10 .. 150 mm |
|---|
| Piece geometry Geometry of wafer pieces the equipment can accept |
triangular shard, other, rectangular, irregular, circular |
|---|
| Piece thickness Range of wafer piece thickness the equipment can accept |
100 .. 3000 µm |
|---|
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
ceramic, gallium arsenide, Foturan (Schott), Pyrex (Corning 7740), Corning 1737, silicon on insulator, alumina, silicon, polycarbonate, sapphire, fused silica |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 3000 µm |
|---|
