on front Contact flat align & expose |
|
| Batch size |
1 |
|---|
| Feature geometry Shape of feature with dimensions characterized by the minimum feature size |
line |
|---|
| Field geometry Shape of field with dimensions characterized by the maximum field size |
circle |
|---|
| Max field size |
100 mm |
|---|
| Min feature size |
2 µm |
|---|
| Sides processed |
either |
|---|
| Wafer size |
|
|---|
| Equipment |
EV420 mask aligner |
| Equipment characteristics: |
| Wafer holder Device that holds the wafers during processing. |
vacuum chuck |
|---|
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
glass (category), silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
|---|
