|
| Batch size |
1 |
|---|
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
10 .. 200 mm |
|---|
| Wafer size |
|
|---|
| Equipment |
Disco Die Saw |
| Equipment characteristics: |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Borofloat (Schott), fused silica, silicon |
|---|
| Wafer thickness List or range of wafer thicknesses the tool can accept |
50 .. 1000 µm |
|---|
