on front Maskless laser write |
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| Process characteristics: |
| Time Estimated write time per wafer |
|
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| Sides processed |
either |
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| Wafer size |
|
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| Equipment |
Custom Heidelberg laser writer |
| Equipment characteristics: |
| Batch sizes |
10 .. 100 mm: 1 |
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| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
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| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
fused silica, gallium arsenide, silicon on insulator, silicon, Pyrex (Corning 7740) |
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| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 5000 µm |
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