Process Hierarchy

Contact mask lithography
A mask of the pattern to be transfered is made on a glass plate. The glass mask is placed directly in contact with the substrate and a light source is used to expose the photoresist. After development, a positive or negative image is created in the photoresist. Most photoresists are positive.
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Process
Contact photolithography (NR1-6000PY)
Contact photolithography (SU-8)
Contact photolithography
G-Line BCB process
Contact G-line photolithography (front-back align, OCG 825 35CS)
Contact G-line photolithography (front-front align, OCG 825 35CS)
Contact I-line photolithography (front-back align, OiR 897 10i)
Contact I-line photolithography (front-front align, OiR 897 10i)
Contact I-line photolithography with back protected (front-back align, OiR 897 10i)
Contact I-line photolithography with back protected (front-front align, OiR 897 10i)
Contact photolithography (Shipley 220)
Contact I-line photolithography (AZ 5214 - MA6) -Image Reversal-
Contact I-line photolithography (AZ 5214 - MA6) -Standard-
Contact I-line photolithography (AZ 5214 - MJB3) -Image Reversal-
Contact I-line photolithography (AZ 5214 - MJB3) -Standard-
Contact I-line photolithography (Shipley 1818 - MA6)
Contact I-line photolithography (Shipley 1818 - MJB3)
Contact photolithography (Image reversal)
Contact photolithography (SU-8)
Contact photolithography (automated)
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