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About MEMS
Lithography: Page 3 of 4
Process Hierarchy
Bonding
Clean
Consulting
Deposition
Doping
Etch
LIGA
Lift off
Lithography
Contact mask lithography
Maskless lithography
Miscellaneous lithography
Projection mask lithography
Mask making
Metrology
Miscellaneous
Packaging
Polishing
Process technologies
Thermal
Unique capabilities
10
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100
per page
Process
Contact G-line photolithography (front-front align, OCG 825 35CS)
Contact I-line photolithography (front-back align, OiR 897 10i)
Contact I-line photolithography (front-front align, OiR 897 10i)
Contact I-line photolithography with back protected (front-back align, OiR 897 10i)
Contact I-line photolithography with back protected (front-front align, OiR 897 10i)
Contact photolithography (Shipley 220)
Contact I-line photolithography (AZ 5214 - MA6) -Image Reversal-
Contact I-line photolithography (AZ 5214 - MA6) -Standard-
Contact I-line photolithography (AZ 5214 - MJB3) -Image Reversal-
Contact I-line photolithography (AZ 5214 - MJB3) -Standard-
Contact I-line photolithography (Shipley 1818 - MA6)
Contact I-line photolithography (Shipley 1818 - MJB3)
5X i-line photolithography (Automated)
Contact photolithography (Image reversal)
Contact photolithography (SU-8)
Contact photolithography (automated)
Contact photolithography (manual)
5x i-line step & expose
Direct laser write
E-beam exposure (ebeam)
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