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MNX

Strip: Page 1 of 2

Process Hierarchy

  • Bonding
  • Clean
  • Consulting
  • Deposition
  • Doping
  • Etch
  • Anisotropic etch
  • Deep RIE
  • Isotropic etch
  • Miscellaneous etch
  • Strip
  • LIGA
  • Lift off
  • Lithography
  • Mask making
  • Metrology
  • Miscellaneous
  • Packaging
  • Polishing
  • Process technologies
  • Thermal
  • Unique capabilities
Strip
Processes used to completely remove a layer of material. Most often used for photoresist removal after pattern transfer to substrate.
per page
Process
Photoresist Removal (for metallized wafers, no gold)
Down Stream Plasma Ashing / Stripping
Photoresist Descum (Ion 40)
Photoresist Strip (Plasmalab)
Photoresist Stripping (Ion 40)
Photoresist wet strip (PRS 3000)
Photoresist wet strip (acetone)
Polymer O2 ICP Etch
Silicon dioxide ISM High Density etch
Silicon dioxide RIE (Plasmalab)
Silicon nitride ISM high density etch
Silicon nitride RIE (PlasmaLab)
Photoresist strip (SU-8)
Photoresist ashing
Photoresist wet strip
Photoresist strip (O2 plasma)
Photoresist wet strip
Photoresist Strip
Photoresist ashing I (metal allowed)
Photoresist ashing II (metal allowed)
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