Post-exposure bake oven |
|
|---|---|
| Model | |
| Type | |
| Equipment Characteristics | |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 mm, 150 mm, 200 mm |
| Wafer holder Device that holds the wafers during processing. |
cassette |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, glass (category), quartz (single crystal), gallium arsenide, silicon on insulator, silicon on sapphire |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |