Metallica Sputtering System |
|
|---|---|
| Model | |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 3, 50 mm: 3, 75 mm: 3 |
| Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular, irregular, circular |
| Piece thickness Range of wafer piece thickness the equipment can accept |
250 .. 1000 µm |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 75 mm, 100 mm |
| Wafer holder Device that holds the wafers during processing. |
palette |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon on sapphire, quartz (single crystal), glass (category), silicon |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
250 .. 1000 µm |