STS PECVD |
|
|---|---|
| Model | |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 2, 50 mm: 2, 75 mm: 2 |
| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, rectangular |
| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 1000 µm |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 75 mm, 100 mm |
| Wafer holder Device that holds the wafers during processing. |
heated plate |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
gallium arsenide, glass (category), quartz (single crystal), silicon, silicon on insulator |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |