| Philips XL-30 ESEM | |
|---|---|
| Model | XL-30 | 
| Type | commercial | 
| Comments | |
| 
 | |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 1, 75 mm: 1 | 
| MOS clean | no | 
| Piece dimension Range of wafer piece dimensions the equipment can accept | 5 .. 100 mm | 
| Piece geometry Geometry of wafer pieces the equipment can accept | circular, irregular, other, rectangular, triangular shard | 
| Piece thickness Range of wafer piece thickness the equipment can accept | 0 .. 1 cm | 
| Wafer diameter(s) List or range of wafer diameters the tool can accept | 50 mm, 75 mm, 100 mm | 
| Wafer geometry Types of wafers this equipment can accept | 1-flat, 2-flat, no-flat, notched | 
| Wafer holder Device that holds the wafers during processing. | aluminum plate | 
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). | alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator, silicon on sapphire, titanium | 
| Wafer thickness List or range of wafer thicknesses the tool can accept | 0 .. 1 cm | 

