Wyko Optical Profiler |
|
|---|---|
| Model | NT3300 |
| Type | commercial |
| Equipment Characteristics | |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
0.1 .. 4 inch |
| Piece geometry Geometry of wafer pieces the equipment can accept |
rectangular, circular, triangular shard, irregular |
| Piece thickness Range of wafer piece thickness the equipment can accept |
200 .. 20000 m |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
2.5 .. 100 mm |
| Wafer geometry Types of wafers this equipment can accept |
no-flat, 1-flat, 2-flat, notched |
| Wafer holder Device that holds the wafers during processing. |
metal chuck |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, alumina, Borofloat (Schott), silicon on insulator, Pyrex (Corning 7740), quartz (single crystal), sapphire, stainless steel |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 2000 µm |