Plasma Therm 770 Silicon DRIE (Bosch Process) |
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|---|---|
| Alternate Name | 770 DRIE |
| Manufacturer | Unaxis |
| Model | 770 |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 1, 150 mm: 1, 75 mm: 1 |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
75 mm, 100 mm, 150 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
| Wafer holder Device that holds the wafers during processing. |
electrostatic chuck |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, silicon on insulator |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 700 µm |
| Attachments | |
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