SMSI 3800 |
|
---|---|
Model | |
Type | |
Equipment Characteristics | |
Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 .. 150 mm |
Wafer holder Device that holds the wafers during processing. |
metal chuck |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
silicon, gallium arsenide, germanium, gallium phosphide |
Wafer thickness List or range of wafer thicknesses the tool can accept |
300 .. 13000 µm |