Karl Suss MA6 Contact Aligner |
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|---|---|
| Model | MA6 |
| Type | commercial |
| Equipment Characteristics | |
| Batch sizes | 100 mm: 1, 150 mm: 1, 50 mm: 1, 75 mm: 1 |
| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, rectangular |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
75 mm, 100 mm, 150 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
| Wafer holder Device that holds the wafers during processing. |
metal chuck |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
gallium arsenide, indium phosphide, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon on insulator |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 800 µm |
| Attachments | |
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