Nanospec
Model Nanospec 6100
Type commercial
Comments
  • Instrument can measure films using visible light source for ordinary thicknesses, and UV light source for very thin films.
  • Visible light source thickness range: 200A to 20um
  • UV light source thickness range: 25A to 20um
  • Polysilicon thickness maximum: 1.5um
Equipment Characteristics
Batch sizes 50 .. 150 mm: 1
Piece dimension
Range of wafer piece dimensions the equipment can accept
 10 .. 150 mm
Piece geometry
Geometry of wafer pieces the equipment can accept
 circular, irregular, other, rectangular, triangular shard
Piece thickness
Range of wafer piece thickness the equipment can accept
 100 .. 1000 µm
Wafer diameter(s)
List or range of wafer diameters the tool can accept
 50 mm, 75 mm, 100 mm, 125 mm, 150 mm
Wafer geometry
Types of wafers this equipment can accept
 1-flat, 2-flat, no-flat, notched
Wafer materials
List of wafer materials this tool can accept (not list of all materials, just the wafer itself).
 gallium arsenide, indium phosphide, silicon, silicon on insulator
Wafer thickness
List or range of wafer thicknesses the tool can accept
 100 .. 150 µm