JEOL SEM |
|
|---|---|
| Model | JSM-840 |
| Type | commercial |
| Equipment Characteristics | |
| MOS clean | yes |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
10 .. 20 mm |
| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular, triangular shard |
| Piece thickness Range of wafer piece thickness the equipment can accept |
100 .. 1000 µm |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, ceramic, Corning 1737, fused silica, gallium arsenide, glass (Hoya), glass-ceramic, indium phosphide, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon on insulator, silicon on sapphire |