Vapor Priming Oven |
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Alternate Name | Yes Oven |
Manufacturer | YES |
Model | 58SM Vapor Priming Oven |
Type | commercial |
Equipment Characteristics | |
Batch sizes | 100 mm: 25, 125 mm: 25, 150 mm: 25 |
MOS clean | no |
Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 mm, 125 mm, 150 mm |
Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
Wafer holder Device that holds the wafers during processing. |
cassette |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
alumina, BK7, Borofloat (Schott), ceramic, copper, Corning 1737, Foturan (Schott), fused silica, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass-ceramic, indium phosphide, lithium niobate, other, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon carbide, silicon germanium, silicon on insulator |
Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |