| Wet bench | |
|---|---|
| Model | |
| Type | commercial | 
| Equipment Characteristics | |
| Batch sizes | 100 mm: 1, 150 mm: 1, 200 mm: 1, 50 mm: 1, 75 mm: 1 | 
| Piece geometry Geometry of wafer pieces the equipment can accept | rectangular, circular | 
| Wafer diameter(s) List or range of wafer diameters the tool can accept | 75 mm, 100 mm, 150 mm | 
| Wafer geometry Types of wafers this equipment can accept | 1-flat, 2-flat | 
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). | quartz (fused silica), silicon carbide, silicon on insulator, quartz (single crystal), sapphire, silicon, Pyrex (Corning 7740), gallium arsenide, indium phosphide | 
| Wafer thickness List or range of wafer thicknesses the tool can accept | 250 .. 800 µm | 

