Nikon Fluorescent Microscope |
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|---|---|
| Model | |
| Type | commercial |
| Equipment Characteristics | |
| Die materials List of allowed materials for dies accepted by this equipment |
Alloy 42, alumina, aluminum, aluminum/copper [99.5:0.5], aluminum/silicon [98:2], aluminum/silicon [99:1], aluminum/silicon/copper [98:1:1], Beryllium Copper, BK7, Borofloat (Schott), borophosphosilicate glass, BPSG, brass, chromium, chromium (transparent), chromium/aluminum, chromium/gold, chromium/gold/chromium, copper, Corning 1737, gallium arsenide, gallium phosphide, germanium, glass (Hoya), glass (spin-on), gold, gold (nano-porous), gold/titanium, indium phosphide, indium tin oxide, Kovar, lead, molybdenum, Nichrome, nickel, palladium, permalloy, phosphosilicate glass, phosphosilicate glass (low temperature), plating base metal, platinum, Pyrex (Corning 7740), quartz (fused silica), quartz (single crystal), sapphire, silicon, silicon (doped), silicon (single crystal), silicon dioxide, silicon dioxide (low temperature), silicon germanium, silicon on insulator, silicon on sapphire, silver, soda lime, stainless steel, tantalum, titanium, titanium/aluminum, titanium/nickel, titanium/tungsten, tungsten, vanadium, white crown |
| MOS clean | yes |
| Piece geometry Geometry of wafer pieces the equipment can accept |
circular, irregular, other, rectangular, triangular shard |
| Piece thickness Range of wafer piece thickness the equipment can accept |
100 .. 5000 µm |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
1 .. 150 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, no-flat, notched |
| Wafer holder Device that holds the wafers during processing. |
glass plate |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 5000 µm |