Vistec EBPG5000+ HR |
|
|---|---|
| Alternate Name | Vistec |
| Manufacturer | Vistec |
| Model | EBPG5000+ HR |
| Type | commercial |
| Equipment Characteristics | |
| Die holder Device that holds the die(s) during processing |
metal chuck |
| Die thickness List or range of die thicknesses the tool can accept |
100 .. 1000 µm |
| MOS clean | no |
| Mask plate dimensions Width, length, thickness of the mask plates (eg. 5x7x0.09 inch). |
5"x5"x0.09", 4"x4"x0.09" |
| Piece dimension Range of wafer piece dimensions the equipment can accept |
3 .. 50 mm |
| Piece geometry Geometry of wafer pieces the equipment can accept |
triangular shard, rectangular, irregular, circular |
| Piece thickness Range of wafer piece thickness the equipment can accept |
100 .. 1000 µm |
| Wafer diameter(s) List or range of wafer diameters the tool can accept |
50 mm, 75 mm, 100 mm, 150 mm |
| Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat |
| Wafer holder Device that holds the wafers during processing. |
metal chuck |
| Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
fused silica, quartz (fused silica), quartz (single crystal), silicon on insulator, gallium arsenide, lithium niobate, silicon, sapphire, silicon carbide |
| Wafer thickness List or range of wafer thicknesses the tool can accept |
100 .. 1000 µm |