Ulvac NE-550 |
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Model | NE-550 |
Type | commercial |
Comments | |
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Equipment Characteristics | |
Batch sizes | 100 mm: 1, 150 mm: 1, 200 mm: 1 |
MOS clean | no |
Wafer diameter(s) List or range of wafer diameters the tool can accept |
100 mm, 150 mm, 200 mm |
Wafer geometry Types of wafers this equipment can accept |
1-flat, 2-flat, notched, no-flat |
Wafer materials List of wafer materials this tool can accept (not list of all materials, just the wafer itself). |
Pyrex (Corning 7740), quartz (fused silica), silicon on insulator, quartz (single crystal), silicon carbide, fused silica, silicon germanium, silicon |
Wafer thickness List or range of wafer thicknesses the tool can accept |
200 .. 1000 µm |